| Description
Toyon
Research Corporation
Description
Novel application of CAD sheet metal functions and neutral
bend surface k-factor were exploited to precisely align circuit
traces and thru-board via holes in conically shaped, thermally
bonded multilayer ceramic-PTFE composite circuit boards. Manufacturing
tooling yielded the required mass quantity fabrication to
meet production cost goals, and included positional float
for each press cavity to prevent over-constraining conditions.
|| datasheet
(pdf) ||
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